[IEEE 2013 14th International Conference on Electronic...

  • Main
  • [IEEE 2013 14th International...

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of temperature on failure mode of solder joint under vibration loading condition

Hongwu, Zhang, Tianhao, Zhao, Yang, Liu, Fenglian,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2013
Language:
english
DOI:
10.1109/icept.2013.6756597
File:
PDF, 839 KB
english, 2013
Conversion to is in progress
Conversion to is failed