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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of temperature on failure mode of solder joint under vibration loading condition
Hongwu, Zhang, Tianhao, Zhao, Yang, Liu, Fenglian,Year:
2013
Language:
english
DOI:
10.1109/icept.2013.6756597
File:
PDF, 839 KB
english, 2013