Wetting interactions between the Ni-Cu-P deposit and In-Sn...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Aug. Vol. 20; Iss. 3

Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun-Jen Chen,, Kwang-Lung Lin,
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.618218
Date:
January, 1997
File:
PDF, 133 KB
english, 1997
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