[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - A novel sensor for the direct measurement of process induced residual stress in interconnects
Horsfall, A.B., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M.Year:
2003
Language:
english
DOI:
10.1109/essderc.2003.1256824
File:
PDF, 338 KB
english, 2003