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[IEEE 2009 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2009) - Xi'an (2009.12.25-2009.12.27)] 2009 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - An improved TDDB lifetime model of copper interconnect
Du Ming,, Ma Peijun,, Li Siyan,, Hao Yue,, Liu Hongxia,Year:
2009
Language:
english
DOI:
10.1109/edssc.2009.5394241
File:
PDF, 5.42 MB
english, 2009