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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints
Jae-Woong Nah,, Suh, J.O., Tu, K.N, Seung Wook Yoon,, Chai Tai Chong,, Kripesh, V., Su, B.R, Chih Chen,Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645720
File:
PDF, 1.18 MB
english, 2006