[IEEE 56th Electronic Components and Technology Conference...

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints

Jae-Woong Nah,, Suh, J.O., Tu, K.N, Seung Wook Yoon,, Chai Tai Chong,, Kripesh, V., Su, B.R, Chih Chen,

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Year:

2006

Language:

english

DOI:

10.1109/ectc.2006.1645720

File:

PDF, 1.18 MB

english, 2006

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