Deformation of bowed silicon chips due to adhesion and...

Deformation of bowed silicon chips due to adhesion and applied pressure

Pamp, Andy, Adams, George G.
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Volume:
21
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856107782105963
Date:
January, 2007
File:
PDF, 1.21 MB
english, 2007
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