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[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes

Aosheng Rong,, Cangellaris, A.C.
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Year:
2001
Language:
english
DOI:
10.1109/epep.2001.967651
File:
PDF, 317 KB
english, 2001
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