[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Reliability aanalysis on the solder joints in space cable connectors
Xiao-chao, Zhang, Zhen-ming, Zhang, Meng, YangYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066973
File:
PDF, 1.69 MB
english, 2011