[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Statistical modeling of via redundancy effects on interconnect reliability
Raghavan, Nagarajan, Cher Ming Tan,Year:
2008
Language:
english
DOI:
10.1109/ipfa.2008.4588156
File:
PDF, 205 KB
english, 2008