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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Thermal performance investigation of three-dimensional structure unit in double-sided cooling IGBT module
Wang, Chunlei, Zheng, Libing, Han, Li, Fang, Huachao, Xu, JuYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922733
File:
PDF, 414 KB
english, 2014