Modeling the power and ground effects of BGA packages

IEEE Transactions on Advanced Packaging 2000 / 5 Vol. 23; Iss. 2

Modeling the power and ground effects of BGA packages

Caggiano, M.F., DelGuidice, B., Tornquist, K.J.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.846626
Date:
May, 2000
File:
PDF, 184 KB
english, 2000
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