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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Subsurface damage distribution of ground silicon wafers
Debao, Yan, Fei, Qin, Jinglong, Sun, Zhongkang, Wang, Liang, TangYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922786
File:
PDF, 686 KB
english, 2014