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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Selective formation of an ultra-thin pore seal on mesorporous low-k for a copper dual damascene structure
Kayaba, Yasuhisa, Tanaka, Hirofumi, Suzuki, Tsuneji, Kohmura, Kazuo, Ono, Shoko SugiyamaYear:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831890
File:
PDF, 279 KB
english, 2014