BCB contact printing for patterned adhesive full-wafer...

Journal of Microelectromechanical Systems 2005 / 04 Vol. 14; Iss. 2

BCB contact printing for patterned adhesive full-wafer bonded 0-level packages

Oberhammer, J., Stemme, G.
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Volume:
14
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2004.839030
Date:
April, 2005
File:
PDF, 1.08 MB
english, 2005
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