[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Design of a high fill-factor micromachined bolometer for thermal imaging applications
Safy, M., Zaky, A. HafzYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699494
File:
PDF, 163 KB
english, 2010