![](/img/cover-not-exists.png)
[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Robust self-aligned via process for 64nm pitch Dual-Damascene interconnects using pitch split double exposure patterning scheme
Tomizawa, H., Chen, S.T., Horak, D., Kato, H., Yin, Y., Ishikawa, M., Kelly, J., Koay, C.S., Landie, G., Burns, S., Tsumura, K., Tagami, M., Shobha, H., Sankarapandian, M., van der Straten, O., ManiscYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940305
File:
PDF, 1.31 MB
english, 2011