Manufacturing and materials properties of Ti/Cu/Electroless...

IEEE Transactions on Components and Packaging Technologies 2000 / Dec. Vol. 23; Iss. 4

Manufacturing and materials properties of Ti/Cu/Electroless Ni/solder bump on Si

Kun-Tzu Hsu,, Kwang-Lung Lin,
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.888849
Date:
January, 2000
File:
PDF, 120 KB
english, 2000
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