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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering
Chen, Limin, Liu, Sang, Ye, Yuming, Tu, Yunhua, Song, zhiwei, Xiang, Zhao, Xu, ZhiYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430700
File:
PDF, 8.01 MB
english, 2006