[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Wetting Dynamics of Eutectic and Lead-Free Solders with Various Reflow Conditions and Surface Finish Metallizations
Suk Chae Kang,, Chunho Kim,, Muncy, J., Schmidt, M., Sangil Lee,, Baldwin, D.Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441369
File:
PDF, 663 KB
english, 2005