[IEEE 2008 International Interconnect Technology Conference...

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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Investigation of the impact of CoWp self-aligned barrier deposition on the porous siOC properties after a direct CMP process

Gall, S., Olivier, S., Assou, M., Bernard, M., Haumesser, P.H., Jayet, C., Maitrejean, S., Hamioud, K., Arnal, V., Passemard, G.
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Year:
2008
DOI:
10.1109/iitc.2008.4546944
File:
PDF, 2.19 MB
2008
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