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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - On the Elements of High Throughput Cu-CMP Slurries Compatible with Low Step Heights

Kanki, T., Shirasu, T., Takesako, S., Sakamoto, M., Asneil, Akbar Ade, Idani, N., Kimura, T., Nakamura, T., Miyajima, M.
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Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546931
File:
PDF, 403 KB
english, 2008
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