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[IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 - Espoo, Finland (18-21 June 2000)] 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) - Anisotropic conductive adhesive films for flip chip on flex packages
Li Li,, Treliant Fang,Year:
2000
Language:
english
DOI:
10.1109/adhes.2000.860586
File:
PDF, 1.48 MB
english, 2000