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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder joints
Chen, Jibing, Lv, Weiwen, An, Bing, Zhou, Longzao, Wu, YipingYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756596
File:
PDF, 993 KB
english, 2013