Dynamic thermal characterization and modeling of packaged...

IEEE Transactions on Components and Packaging Technologies 2000 / 6 Vol. 23; Iss. 2

Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBTs

Busani, M., Menozzi, R., Borgarino, M., Fantini, F.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.846774
Date:
June, 2000
File:
PDF, 173 KB
english, 2000
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