[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Chul-Won Ju,, Seong-Jin Kim,, Kyu-Ha Pack,, Hee-Tae Lee,, Young-Chul Hyun,, Seong-Su Park,Year:
2002
Language:
english
DOI:
10.1109/ectc.2002.1008255
File:
PDF, 395 KB
english, 2002