Duromer MID technology for system-in-package generation

Becker, K.-F., Braun, T., Neumann, A., Ostmann, A., Koch, M., Bader, V., Aschenbrenner, R., Reichl, H., Erik Jung,

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Volume:

Language:

english

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

DOI:

10.1109/tepm.2005.856537

Date:

October, 2005

File:

PDF, 1.72 MB

english, 2005

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