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Duromer MID technology for system-in-package generation
Becker, K.-F., Braun, T., Neumann, A., Ostmann, A., Koch, M., Bader, V., Aschenbrenner, R., Reichl, H., Erik Jung,Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.856537
Date:
October, 2005
File:
PDF, 1.72 MB
english, 2005