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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Modeling techniques for board level drop test for a wafer-level package
Dhiman, Harpreet S., Xuejun Fan,, Tiao Zhou,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607141
File:
PDF, 814 KB
english, 2008