[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing
Lai, Yi-Shao, Chiu, Ying-TaYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373988
File:
PDF, 3.18 MB
english, 2007