Reliability of PBGA assemblies under out-of-plane vibration...

IEEE Transactions on Components and Packaging Technologies 2002 / 06 Vol. 25; Iss. 2

Reliability of PBGA assemblies under out-of-plane vibration excitations

Yang, Q.J., Wang, Z.P., Lim, G.H., Pang, J.H.L., Yap, F.F., Lin, R.M.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2002.1010020
Date:
June, 2002
File:
PDF, 360 KB
english, 2002
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