[IEEE 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Yokohama, Japan (2014.9.9-2014.9.11)] 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - A three-dimensional TCAD system focused on power and nano-scaled devices applications
Ookura, Yasuyuki, Kato, Nobuhiko, Kobayashi, Shin-ichiro, Kuwabara, Takuhito, Harada, Masanori, Yamaguchi, Ken, Koike, HideakiYear:
2014
Language:
english
DOI:
10.1109/sispad.2014.6931597
File:
PDF, 1.23 MB
english, 2014