[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Adhesive enabling technology for directly plating copper onto glass/ceramic substrates
Fu, Hailuo, Hunegnaw, Sara, Liu, Zhiming, Brandt, Lutz, Magaya, TafadzwaYear:
2014
DOI:
10.1109/ectc.2014.6897517
File:
PDF, 2.09 MB
2014