[IEEE 2011 IEEE 61st Electronic Components and Technology...

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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Ultra low cost wafer level via filling and interconnection using conductive polymer

Saint-Patrice, D., Jacquet, F., Bridoux, C., Bolis, S., Anciant, R., Pouydebasque, A., Sillon, N., Vigier-Blanc, E.
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Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898742
File:
PDF, 1.71 MB
english, 2011
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