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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Degradation Mechanism and Reliability of Flip-Chip Interconnects using Anisotropic Conductive Adhesives for High Current Density Packaging Applications
Myung Jin Yim,, Hyoung Joon Kim,, Chang Kyu Chung,, Kyung Wook Paik,Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645668
File:
PDF, 1022 KB
english, 2006