[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Factors affecting Pb-free flip chip bump reliability modeling for life prediction
Syed, Ahmer, Sharon, Gil, Darveaux, RobertYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249069
File:
PDF, 1.56 MB
english, 2012