[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Wire sweep study for SOT package array matrix molding with simulation and experimental analysis
Han, Jiale, Chen, Haibin, Xue, Ke, Wong, Fei, Leung, Karina, Shiu, Ivan, Wu, JingshenYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066692
File:
PDF, 3.31 MB
english, 2011