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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Effects of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Tang, George CW, Shing, Jacqueline WK, Chen, Haibin, Lee, Ricky, Wu, Jingshen, McLellan, NeilYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430671
File:
PDF, 3.30 MB
english, 2006