IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1995 / 5 Vol. 18; Iss. 2
C-4/CBGA comparison with other MLC single chip package alternatives
Puttlitz, K.J., Shutler, W.F.Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.386257
Date:
May, 1995
File:
PDF, 655 KB
english, 1995