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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Thin polymer dry-film dielectric material and a process for 10 um interlayer vias in high density organic and glass interposers
Suzuki, Yuya, Takagi, Yutaka, Sundaram, Venky, Tummala, RaoYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897481
File:
PDF, 847 KB
english, 2014