Integration of vapor deposited polyimide into a multichip...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Feb. Vol. 20; Iss. 1

Integration of vapor deposited polyimide into a multichip module packaging process

Liberman, V., Malba, V., Bernhardt, A.F.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.554454
Date:
January, 1997
File:
PDF, 93 KB
english, 1997
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