[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Effect of Ni Plating Thickness on Fatigue Failure of Lead-free Solder Joints
Omiya, Masaki, Miyazaki, Takeshi, Inoue, Hirotsugu, Kishimoto, Kikuo, Amagai, MasazumiYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430655
File:
PDF, 1.86 MB
english, 2006