[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, Hiroyuki, Ogashiwa, Toshinori, Kanehira, Yukio, Ito, Shin, Yazaki, Takuya, Mizuno, JunYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248979
File:
PDF, 2.89 MB
english, 2012