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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Warpage characterization of panel Fan-out (P-FO) package
Liu, Hung-Wen, Liu, Yi-Wei, Ji, Jason, Liao, Jash, Chen, Agassi, Chen, Yan-Heng, Kao, Nicholas, Lai, Yi-CheYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897534
File:
PDF, 2.43 MB
english, 2014