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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - A low temperature, hermetic wafer level packaging method for RF MEMS switch
Woonbae Kim,, Qian Wang,, Junsik Hwang,, Moonchul Lee,, Kyudong Jung,, SukJin Ham,, Changyoul Moon,, Kyedong Baeks,, Byeoungju Ha,, Insang Song,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441410
File:
PDF, 810 KB
english, 2005