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[IEEE 2011 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2011.04.10-2011.04.14)] 2011 International Reliability Physics Symposium - Electromigration failure mechanisms for different flip chip bump configurations
Labie, Riet, Webers, Tomas, Winters, Christophe, Cherman, Vladimir, Croes, Kristof, Vandevelde, Bart, Dosseul, FranckYear:
2011
Language:
english
DOI:
10.1109/irps.2011.5784541
File:
PDF, 984 KB
english, 2011