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Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
Myung-Jin Yim,, Kyung-Wook Paik,Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.910798
Date:
March, 2001
File:
PDF, 134 KB
english, 2001