[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging
Su, Yen-Fu, Lin, Chun-Te, Kuo, Tzu-Ying, Chiang, Kuo-NingYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575826
File:
PDF, 885 KB
english, 2013