[IEEE 2014 16th European Conference on Power Electronics and Applications (EPE'14-ECCE Europe) - Lappeenranta, Finland (2014.8.26-2014.8.28)] 2014 16th European Conference on Power Electronics and Applications - Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting
Conrad, Marcus, De Doncker, Rik W., Schniedenharn, Maximilian, Diatlov, AndreiYear:
2014
Language:
english
DOI:
10.1109/epe.2014.6910965
File:
PDF, 1.65 MB
english, 2014