[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Novel Flip-Chip Bonding Technology using Chemical Process
Yamaji, Yasuhiro, Yokoshima, Tokihiko, Oosato, Hirotaka, Igawa, Noboru, Tamura, Yuichiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, MasahiroYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373905
File:
PDF, 3.03 MB
english, 2007