Compliant bumps for adhesive flip-chip assembly

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Compliant bumps for adhesive flip-chip assembly

Keswick, K., German, R.L., Breen, M., Nolan, R.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404108
Date:
January, 1995
File:
PDF, 850 KB
english, 1995
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