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[IEEE IEEE 1995 International Integrated Reliability Workshop. Final Report - Lake Tahoe, CA, USA (22-25 Oct. 1995)] IEEE 1995 International Integrated Reliability Workshop. Final Report - A new technique to measure thin oxide thickness in IC manufacturing
Nayak, D.K., Wang, L., Rakkhit, R.Year:
1995
Language:
english
DOI:
10.1109/irws.1995.493597
File:
PDF, 97 KB
english, 1995